Mechanical Characterisation of Cast Sn-XFeO-0.2Cu Solder Alloy
Keywords:
Solder alloy, iron millscale, copper-tin, characterisation, mechanical properties
Abstract
The act of soldering that is devoid of any debilitating health hazards is a global concern necessitating the
development of varied lead-free solders exhibiting desirable solderability. In this study, a lead-free solder composed
of tin-iron millscale-copper (Sn-FeO-0.2Cu) alloy was fabricated by casting and characterised for mechanical
properties critical to its functionality while the iron millscale (IMS) varied from 1-5 wt.%. The cast alloy samples
were evaluated for microstructure and mechanical properties (elastic modulus, yield strength, ultimate tensile
strength and hardness) using optical microscope and relevant state of the arts mechanical characterisation tools
respectively. Results show positive comparison with established solders mechanical properties. This is attributed to
the coherency of IMS with the tin matrix on one hand and the role of dislocation motion impediment played by the
Fe-Cu intermetallic formed within the relatively soft tin matrix on the other. The solder melts in the range of 245-
2550C suggesting its suitability for soldering electric motors, car radiators and other high melting point (HMP)
soldering
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Retrieved on 7th December 2017.
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Containing La”. Transactions of Nonferrous Metals Society of China, Vol. 17, No. 1, pp. 1043-1048.
Applications”. .Journal of Material Science and Material Electronics, Vol. 18, pp 55-76.
Alan, B., Christopher. H., Milos, D. and Jaspal, N. (2002). “Reliability of Joints Formed with Mixed Alloy Solders”.
Materials Centre, National Physical Laboratory, pp. 1-18.
Askeland, D. R. (1989). “The Science and Engineering of Materials”. Second Edition, PWS-KENT Publishing
Company, USA, pp. 68-75.
Bhagava A. K. and Sharma, C. P. (2011). “Mechanical Behaviour and Testing of Materials”. PHI Learning Private
Limited, Eastern Economy Edition, New Delhi, pp. 105-107.
Bradley, E. and Hrenisavljevic, J. (2001). “Characterisation of the Melting and Wetting of Sn-Ag-x Solder”. IEEE
Transactions on Electronics Packaging Manufacturing, Vol. 24, No. 4, pp. 255-259.
Carol, H., Ursula, K. and Kil-Won, M. (2007). “Fundamental Properties of Pb-free Solder Alloys”. Bath J. Edition, p.
299.
Chawla, N., Ochoa, F., Ganesh, V., Deng, X., Koopman, K. and Scarritt, S. (2004). “Measurement and Prediction of
Young’s Modulus of a Lead-free Solder”. Journal of Materials Science: Materials in Electronics, Vol. 15, pp.
385-388.
Chen, H. T., Ya, B. B., Yang, M., Ma, X. and Mingyu, L. (2012). “Effect of Grain Orientation on Mechanical Properties
and Thermo-mechanical Response of Sn-based Solder Interconnects”. Journal of Material Characteristics.
Vol. 8, pp 64-72.
Danlov, E. V. (2003). “Economic Method of Recycling Metallurgical and Millscale by Sitfer Technology in an Arc
Steelmaking Furnace”. Metallurgist, 47, 5-6, pp. 197-205.
Ervina, E. M., Nur, F. M. and Mohd, M. A. (2017). “Influence of Dopants on Lead-free Solder Alloy”. American
Institute of Physics (AIP), Vol. 1835, doi.org/10.1063/1.5012611.
Gaballahi, N. M., Zikry1, A. F., Khalifa, M. G., Farag, A. B., El-Hussin, N. A. and Shalabi, M. E. (2013). “Production of
Iron from Mill Scale Industrial Waste via Hydrogen”. Journal of Inorganic Non-metallic Materials, Vol. 3
No. 3, pp. 34-42.
Hiroyuki, T., Lang, F. Q., Osamu, M. T. and Toshio, N. (2005). “Elastic Properties of Sn-Based Solder Alloys
Determined by Ultrasonic Pulse Echo Method”. Japan Institute of Metals: Materials Transactions, Vol. 46,
No. 6, pp. 1271-1273.
International Iron and Steel Institute-IISI (1987). “The Management of Steel Industry By-Products and Waste”.
Report of Committee on Environmental Affairs, pp. 1-21.
Lau, H. John and Pao Yi-Hsin (1997). “Solder Joint Reliability of BGA, CSP, Filp Chip and Fine Pitch SMT Assemblies”.
Mc-Graw Hill, pp. 132-147.
Leads Direct (2006). “Soldering Regulations”. www.leadsdirect.co.uk/technical-library/soldering. Retrieved on 8th
October, 2017.
Lewis, D., Allen, S., Notis, M. and Scotch, A. (2002). “Determination of the Eutectic Structure in the Sn-Ag-Cu
System”. Journal of Electronic Materials, Vol. 31, No. 2, pp. 161-167.
Mamdouh, E., Azza, A. and Mohammed, E. (2015). “Conversion of Millscale Waste into Valuable Products via
Carbothermic Reduction”. Journal of Metallurgy, Vol. 2015, pp. 1-9.
McCormack, M, Jin, S. and Kammloth, G. W. (1994). “Enhanced Solder Alloy Performance by Magnetic
Dispersions”. Packaging and Manufacturing Technology: Part A-IEEE Transactions on Components, Vol. 17,
Issue 3, pp. 452-457.
Oh, C. S., Shim, J. H., Lee, B. J. and Lee, D. N. (1996). “Thermodynamic Study on Ag-Sb-Sn System”. Journal of Alloys
and Compounds, Vol. 238, Issues 1-2, pp. 155-166.
Qing, W., William, F. and Johnson, R. (2005). “Mechanical and Microstructure Investigation of Lead-Free Solder”.
NASA and Allied Aerospace Research, pp. 83-95.
Saberifar, S., Jafari, F., Kardi, H., Jafarzadeh, M. and Mousavi, S. (2014). “Recycling Evaluation of Millscale in Electric
Arc Furnace”. Journal of Advanced Materials and Processing, Vol. 2, No. 3, pp. 73-78.
Seok-Heumbaek, S. H., Seok-Swoocho, D. J. and Won, S. (2010). “Optimisation of Process Parameters for Recycling
of Millscale Using Taguchi Experimental Design”. Journal of Mechanical, Science and Technology, Vol. 24,
Issue 10, pp. 2127-2134.
Thomas, S. Stephen, L., David, S. and Juan, C. (2002). “Database for Solder Properties with Emphasis on New Leadfree Solders”. National Institute of Standards and Technology, Colorado School of Mines Release 4.0, pp.
8-27.
Warren H. H. (2004). “Global Perspectives on Electronic Materials: Challenges and Opportunities”. TMS
Proceedings of the 46th Electronic Materials Conference (EMC). www.tms.org/pubs/journals/JOM/0406/.
Retrieved on 7th December 2017.
Yee, M. L. and Haseeb. A. S. (2016). “Soldering Characteristics and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder
with Minor Aluminum Addition”. Journal of Materials, 9, 522, pp. 1-17.
Zhou, Y. C., Pan, Q. L. and He, Y. B. (2007). “Microstructures and Properties of Sn-Ag-Cu Lead-free Solder Alloys
Containing La”. Transactions of Nonferrous Metals Society of China, Vol. 17, No. 1, pp. 1043-1048.
Published
2020-07-26
How to Cite
Sekunowo, O. I., Durowaye, S., & Runsewe, A. M. (2020). Mechanical Characterisation of Cast Sn-XFeO-0.2Cu Solder Alloy. Journal of Engineering Research, 23(1), 90-99. Retrieved from http://jer.unilag.edu.ng/article/view/973
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